Tamin M.N., Shaffiar N.M. Solder joint reliability assessment. Finite element simulation methodology

Springer, 2014. — 174 p. — (Advanced Structured Materials, Vol. 37). — ISBN: 978-3-319-00091-6, 978-3-319-00092-3.This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.Trends in Electronics’ Packaging.
Electronic Assembly with Flip Chip Package.
Solder Joint Reliability Assessment.
Solder Joint Reliability Simulation.
References.
Overview of the Simulation Methodology.
Introduction.
Simulation of Physical Phenomena.
Numerical Experiment Framework.
Deriving Finite Element Equations.
Procedures for Finite Element Simulation.
References.
Essentials for Finite Element Simulation.
Introduction.
Model Geometry.
Finite Element Mesh and Mesh Study.
Boundary Conditions.
Load and Load Cycles.
Material Models.
Aspects of Model Validation.
Interpretation of Results.
References.
Mechanics of Solder Materials.
Introduction.
Elastic Behavior and Yielding.
Plasticity and Hardening.
Creep Response.
Unified Inelastic Strain Theory.
Cyclic Behavior.
References.
Application I: Solder Joint Reflow Process.
Introduction.
Finite Element Modeling.
Residual Internal States in the Critical Solder Joint.
References.
Application II: Solder Joints Under Temperature and Mechanical Load Cycles.
Introduction.
BGA Assembly Under Temperature Cycles.
BGA Assembly Under Cyclic Flexural Load.
BGA Assembly Under Cyclic Torsional Load.
References.
Damage Mechanics-Based Models.
Introduction.
Material Damage Concept.
Cohesive Zone Model.
Continuum Damage Model.
References.
Application III: Board-Level Drop Test.
Introduction.
Simulation of Board-Level Drop Test.
Mathematical Model.
Finite Element Modeling.
Interface Damage Initiation and Dynamic Propagation.
References.
Application IV: Fatigue Fracture Process of Solder Joints.
Introduction.
Cyclic Shear Loading of a Solder Joint.
Finite Element Modeling.
Stress and Inelastic Strain Distribution in the Solder Joint.
Characteristic Damage Evolution.
Cyclic Flexural Loading of BGA Assembly with Damaging Solder Joints.
References.
Closure.